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MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position

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MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position

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Brand Name : HSTECH

Model Number : HS-620

Certification : CE

Place of Origin : China

MOQ : 1 set

Price : Negotiable

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 100 sets per month

Delivery Time : 7~9 work days

Packaging Details : Wooden package

Product Name : BGA Rework Station

Warranty : 1 Year

Control : Touch Screen

Optoelectronic Switch : OMRON

Material : Aluminum Alloy

Condition : New

Thickness : 0.3 - 5mm

Power Supply : AC220V

Air Pressure : 4-6bar

Weight : 30KG

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MCGS Touch Screen Control Manual & Automatic Laser Position BGA Rework Station

Introduction

A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging to repair when defects occur.

Features:

1.Automatic&Manual operation system.

2. 5 million CCD camera optical alignment system mount precision:±0.01mm.

3.MCGS touch screen control.

4.Laser position.

5.Repair success rate 99.99%.

​Specification:

BGA Rework Station Model:HS-620
Power Supply AC 220V±10% 50/60Hz
Total power 3500W
Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
Electric material Driving motor+PLC smart temp.controller+color touch screen
Temperature control independent temp.controller,the precision can reach ±1℃
Temperature Interface 1pcs
Locating way V shape slot,PCB support jigs can adjust,laser light do fast centering and position
Overall dimension L650mm*W630mm*H850mm
PCB size Max 450mm*390mm Min 10mm*10mm
BGA size Max 80mm*80mm Min 1mm*1mm
Weight of machine 60KG
Usage Repair chips / phone motherboard etc

Applications


BGA Component Replacement:
Used to remove faulty BGA components and replace them with new ones, essential for repairs and upgrades.
Solder Joint Repair:
Facilitates the reflow of solder joints for reworking connections that may have failed or become cold soldered.
Prototyping:
Useful in prototyping environments where BGA components need to be frequently replaced or modified.
Quality Control:
Employed in quality control processes to inspect and repair PCBs before final assembly or shipment.


Benefits


Increased Reliability:
Enables effective repair of BGA components, extending the life of PCBs and reducing waste.
Cost-Effective Repairs:
Reduces the need for complete PCB replacements, saving costs in manufacturing and maintenance.
Enhanced Precision:
Provides precise temperature control and alignment for high-quality rework results.
Time Efficiency:
Streamlined rework processes allow for quicker turnaround times in manufacturing and repair environments.
Flexibility:
Can handle various sizes and types of BGA components, making them versatile for different applications.

MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position

MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position


Quality MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position for sale

MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position Images

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